随着数据中心和云端运算的快速发展，服务器对于电源供应器的效能需求日益提升，故所采用的功率元器件持续往具有更低的损耗和更快的切换速度演进。这不仅提高了整体系统效率，还有助于服务器在高负载下稳定运行，减少能源浪费。采用高性能功率元器件可缩小电源供应器的体积，减少尺寸，进一步提升空间利用率。这对于密集型数据中心尤为重要，有助于降低整体运营成本。

TSC的产品提供了广泛范围的AC-DC转换器所需的功率级分立元器件。除了在Bridge与Diode中有各式各样的电气与封装规格，也推出有低导通Vf 的LLD系列，而在高阶应用也推出650V SiC Schottky Diode; 另外在MOSFET 产品中则有600V Super junction，和低压40V，80V，100V等，封装样式则有TO220, TO247, PDFN33, PDFN56等，在开关电源应用中可选择具有低导通电压的LLD Bridge, 还有Super junction Gen4 and低FOM (Rds(on)*Qg) 的 PerFETTM系列产品。

With the rapid growth of data centers and cloud computing, the demand for higher power efficiency in server power supplies is increasing. As a result, power components are continuously evolving to offer lower losses and faster switching speeds. This not only improves overall system efficiency but also helps servers operate stably under heavy loads, reducing energy waste. Using high-performance power components can also minimize the size of power supplies, improving space utilization — a crucial factor for dense data centers, ultimately lowering overall operational costs.

TSC offers a comprehensive range of discrete power products essential for AC-DC converter power stages. In addition to a variety of electrical and packaging specifications for Bridge and Diode components, TSC has introduced the LLD series featuring low forward voltage (Vf). For advanced applications, a 650V SiC Schottky Diode is available. In MOSFET products, TSC provides a 600V Super Junction series, along with low-voltage options such as 40V, 80V, and 100V. Packaging options include TO220, TO247, PDFN33, and PDFN56, etc.. For SMPS applications, TSC offers the LLD Bridge with low forward voltage, as well as the Super Junction Gen4 and PerFET™ series with low FOM (Rds(on) * Qg) for enhanced performance.